13.3 Screen touch .

Product ɲɛfɔli .

13.3 touch screen ni Cypress touch controller IC projɛlen bɛ se ka baara dɛmɛ ni ganw ye, ji , ani ka baara kɛ ka ɲɛ ni 10mm thick tempered glass walima thick PC ye datugulan gilasi sanfɛ, , min bɛ kɛ kɛrɛnkɛrɛnnenya la furakɛlifɛnw na, piblisite minɛnw, lakana ani foro wɛrɛw, i n’a fɔ structurel parts ani surface treatment --ag ar af, irregular structure wdfl.

Capacitive 13.3 touch screen projected bɛ bɔ USB interface la, 1920*1080 Resolution Display Screen ani EDP interface, o bɛ se ka bɛn ni baarakɛcogo caman ye minnu bɛ kɛ ɲɔgɔn fɛ, a bɛ se ka kɛ ni drive board ni cable ye, min bɛnnen don kosɛbɛ fla assemble module structure installation products ma. Siliki screen sɛbɛnni lamini ye nɛrɛ ye, a jiralan polarizer ye nɛrɛ ye, o la fiɲɛ sirili nɔ nɛrɛma ka fisa;

Technique Q&A

J: Optique bonding touch screen module solution bɛna jateminɛ kɛ cogo jumɛn na?

A: 1. Ni kiliyan ka wajibiw ka bon fɛn dilannen cɛɲi bɛɛ lajɛlen na, u bɛ se ka jateminɛ kɛ optiki jɛɲɔgɔnya kan bawo modulu bɛɛ ka nɔ nɛrɛma bɛɛ ka ɲi kosɛbɛ optique bonding kɔfɛ 2. Ni kiliyan ka fɛn dilannen yɛrɛ bɛ ni wajibibaw ye i n’a fɔ anti-Shock effect ani Impact resistance a ka baarakɛyɔrɔ la, optique bonding solution bɛ se ka jateminɛ 3. Ni kiliyan ka fɛn dilannen bɛ kɛnɛma ani ni wajibi dɔw bɛ tile ɲɛ yecogo la ani funteni & nɛnɛba sabatili ani a bɛɛ lajɛlen sigicogo, optique bonding plan ka kan ka jateminɛ

J: ESD ka fɛɛrɛ jumɛnw bɛ sɔrɔ EMC sɛgɛsɛgɛli la labanfɛnw na?

A: A bɛɛ lajɛlen fura ye ka kuran jɔlen to duguma. Nin hakilina ninnu bɛ yen kosɛbɛ:

1), Power Supply Plus TVS Tube: Walasa ka ESD lakana ka bɔ kuran na VCC, TVS tube bɛ se ka don ani ka ɲɛnabɔ. TVS tube ni tension regulator diode bɔlen don kosɛbɛ. A bɛ ni tension (volta) hakɛ ye min bɛ jate. Danfara min bɛ o ni ɲɔgɔn cɛ, o ye ko a jaabi teliya bɛ teliya kɛrɛnkɛrɛnnenya la wa a bɛ bɔli kɛ cogo ɲuman na kuran jɔlen na.

2) ESD lakanani kɛnɛma taamasiyɛn sira kan: I bɛ se ka kɔfɛla diode jateminɛ ani k’a siri walasa ka kuran ɲɛminɛ ka taa kuran walima dugukolo la;

3), LC filɛri bɛ fara minɛnw kan minnu bɛ se ka fɛnw sɛgɛsɛgɛ: IC dɔw bɛ se ka kuran jɔlen to kɛrɛnkɛrɛnnenya la. Ni ESD sɛgɛsɛgɛliw kɛra, a bɛ segin ka kɛ walima a bɛ sa tuma bɛɛ. O sababu ye ko a ka c’a la, kuran-minɛn bɛ jɔrɔ. O kama, LC filɛri bɛ se ka fara a ka kuran kan.

4) PCB Paving Requirements: PCB ka kan ka dilan ni a bɛ se ka kɛ cogo min na. Ni pankurun fila don, fan fila bɛɛ ka kan ka kɛ ni nɛgɛ ye yɔrɔba dɔ la, ani dugukolo dingɛw ka kan ka sɔrɔ. Ni a ye naani-Layer board ye walima a sanfɛ, a yɔrɔba layɛrɛba ka plane layer ka kan ka sigi formation dɔ kan.

5) Dugukoloko wajibiyalenw : Walasa ka kuran jɔlen bɔ ka ɲɛ, dugukolo ɲuman ka kan ka garanti. Misali la, furakɛli elekitoronikiw, furakɛli ɛntɛrinɛti fɛn bɛɛ i n’a fɔ monitors, o bɛna kɛ grounding laban ye min bɛ se ka kɛ fuselage kɔfɛ. Ni ESD sɛgɛsɛgɛliw bɛ kɛ, nin dugukolo dakun in fana bɛ tali kɛ dugukolo la, o la, fɛɛrɛ bɛ yen ka kuran jɔlen bɔ joona. 6) PCB layout wiring: Ni chip ka decoupling capacitor yɔrɔ ka jan chip pinɛ na, decoupling effect bɛna tunun. Ni taamasiɲɛ sɛgɛsɛgɛlenw layini janya ka bon kojugu, kuran-magnetiki-ko-ɲɛnabɔli bɛna don sen kan min ma labɛn. Anti-ESD siratigɛ la, minɛn minnu bɛ se ka fɛn sɛgɛsɛgɛ walima taamasiyɛnw (i n’a fɔ a bɛ segin ka kɛ cogo min na) olu ka kan ka to ka bɔ PCB da la walasa fiɲɛ kana bɔ ka ɲɛsin minɛnw ni taamasiyɛnw ma. PCB da la, a ka kan ka kɛ ni gap walima kuran bonya dɔ ye.

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